F0805B3R00FWTR

Kyocera AVX · 0805

Fuse Chip Fast Acting 3A SMD Solder Pad 0805 T/R

RoHSNon-Compliant

Manufacturer: Kyocera AVX
Package / case: 0805
Mounting style: Surface Mount
Depth: 1.27mm
Width: 1.27mm
Height: 889µm
Length: 2.1mm
Approvals: UL
Lead Free: Contains Lead
Resistance: 50mΩ
Composition: Thin Film
Current Rating: 3A
Number of Pins: 2
Contact Plating: Lead, Tin
Radiation Hardening: No
Voltage Rating (AC): 63V