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KHBBC4B03C-MC1KT00
Samsung Electro-Mechanics · Active
36GB High Bandwidth Memory (HBM3E) DRAM chip featuring a 12-layer stack structure, 9.2 Gbps per pin transmission speed, and a 1024-bit memory bus organization, packaged in a compact MPGA format.
LifecycleActiveRoHSCompliantECCN3A090.cHTSUS8542.32.00
- Manufacturer
- Samsung Electro-Mechanics
- Product series
- HBM3E
- Classification
- Active
- Categories
- Memory · Other
- Packaging
- Tray
Common questions about KHBBC4B03C-MC1KT00
- What is KHBBC4B03C-MC1KT00?
- KHBBC4B03C-MC1KT00 is 36GB High Bandwidth Memory (HBM3E) DRAM chip featuring a 12-layer stack structure, 9.2 Gbps per pin transmission speed, and a 1024-bit memory bus organization, packaged in a compact MPGA format., manufactured by Samsung Electro-Mechanics.
- Who manufactures KHBBC4B03C-MC1KT00?
- KHBBC4B03C-MC1KT00 is manufactured by Samsung Electro-Mechanics.
- Is KHBBC4B03C-MC1KT00 RoHS compliant?
- The RoHS status of KHBBC4B03C-MC1KT00 is: Compliant.
- Is KHBBC4B03C-MC1KT00 still in production?
- KHBBC4B03C-MC1KT00 has a lifecycle status of Active.
- Where can I buy KHBBC4B03C-MC1KT00?
- Send an RFQ to Makat and our AI agents source KHBBC4B03C-MC1KT00 across the whole supplier network, with verified offers inside 48 hours.