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Catalog

MCZ33887EKR2

NXP Semiconductors · SOIC

Analog / Mixed Signal ICs - Power Actuation H-BRIDGE W/LD CUR FDBK

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RoHSCompliant
Manufacturer
NXP Semiconductors
Categories
Semiconductors · Sensors · Pressure Sensors
Package / case
SOIC
Mounting style
Surface Mount
Packaging
Tape & Reel
Lead Free
Lead Free
Number of Pins
54
Operating Supply Voltage
28V
Max Operating Temperature
125°C
Min Operating Temperature
-40°C

Common questions about MCZ33887EKR2

What is MCZ33887EKR2?
MCZ33887EKR2 is Analog / Mixed Signal ICs - Power Actuation H-BRIDGE W/LD CUR FDBK, manufactured by NXP Semiconductors.
Who manufactures MCZ33887EKR2?
MCZ33887EKR2 is manufactured by NXP Semiconductors.
What package does MCZ33887EKR2 come in?
MCZ33887EKR2 comes in a SOIC package (Surface Mount).
Is MCZ33887EKR2 RoHS compliant?
The RoHS status of MCZ33887EKR2 is: Compliant.
Where can I buy MCZ33887EKR2?
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