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XCV812E-6FG900C
Xilinx · FBGA
IC FPGA 556 I/o 900FBGA
RoHSNon-Compliant
- Manufacturer
- Xilinx
- Categories
- Semiconductors · Integrated Circuits (ICs) · Embedded Processors and Controllers · Field Programmable Gate Arrays (FPGAs)
- Package / case
- FBGA
- Mounting style
- Surface Mount
- RAM Size
- 140kB
- Lead Free
- Contains Lead
- Number of I/Os
- 556
- Number of Pins
- 900
- Number of Gates
- 254016
- Radiation Hardening
- No
- Operating Supply Voltage
- 1.8V
- Max Operating Temperature
- 85°C
- Min Operating Temperature
- 0°C
- Number of Logic Blocks (LABs)
- 4704
- Number of Logic Elements/Cells
- 21168
Common questions about XCV812E-6FG900C
- What is XCV812E-6FG900C?
- XCV812E-6FG900C is IC FPGA 556 I/o 900FBGA, manufactured by Xilinx.
- Who manufactures XCV812E-6FG900C?
- XCV812E-6FG900C is manufactured by Xilinx.
- What package does XCV812E-6FG900C come in?
- XCV812E-6FG900C comes in a FBGA package (Surface Mount).
- Is XCV812E-6FG900C RoHS compliant?
- The RoHS status of XCV812E-6FG900C is: Non-Compliant.
- Where can I buy XCV812E-6FG900C?
- Send an RFQ to Makat and our AI agents source XCV812E-6FG900C across the whole supplier network, with verified offers inside 48 hours.