XPC823ZT66B2T

NXP Semiconductors · BGA

Microprocessor IC; Package/Case:256-PBGA; Interfaces:I2C,RS232,SPI,TDM; Leaded Process Compatible:No; Peak Reflow Compatible (260 C):No; Number of Timers:4 RoHS Compliant: No

RoHSNon-Compliant

Manufacturer: NXP Semiconductors
Package / case: BGA
Frequency: 66MHz
Lead Free: Contains Lead
Number of Pins: 256
Core Architecture: PowerPC
Max Operating Temperature: 95°C
Min Operating Temperature: 0°C