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573300D00010G
Boyd Laconia, LLC · TO-263 · Active
HEATSINK D2PAK .4" HIGH SMD
Also listed as HS338TR, HS338DKR, 041644, HS338CT, Q4525657
LifecycleActiveRoHSCompliantECCNEAR99HTSUS8473.30.5100
- Manufacturer
- Boyd Laconia, LLC
- Product series
- 573300
- Classification
- Passive
- Categories
- Semiconductors · Electromechanical · Thermal Management · Heat Sinks
- Type
- Top Mount
- Package / case
- TO-263
- Mounting style
- Surface Mount
- Packaging
- Tape & Reel (TR)
- Standard packaging qty
- 250
- Manufacturer lead time
- 1568 days
- Dimensions
- 0.500" (12.70mm) × 1.030" (26.16mm) × 0.400" (10.16mm)
- Material
- Copper
- Depth
- 12.7mm
- Shape
- Rectangular
- Width
- 26.16mm
- Height
- 10.16mm
Show 8 more specificationsShow fewer specifications
- Length
- 26.16mm
- Lead Free
- Lead Free
- REACH SVHC
- No
- Schedule B
- 8542900000
- Height Off Base
- 10.16mm
- Radiation Hardening
- No
- Natural Thermal Resistance
- 18°C/W
- Thermal Resistance @ Forced Air Flow (100 LFM)
- 10°C/W
Documents & media
Common questions about 573300D00010G
- What is 573300D00010G?
- 573300D00010G is HEATSINK D2PAK .4" HIGH SMD, manufactured by Boyd Laconia, LLC.
- Who manufactures 573300D00010G?
- 573300D00010G is manufactured by Boyd Laconia, LLC.
- What package does 573300D00010G come in?
- 573300D00010G comes in a TO-263 package (Surface Mount).
- Is 573300D00010G RoHS compliant?
- The RoHS status of 573300D00010G is: Compliant.
- Is 573300D00010G still in production?
- 573300D00010G has a lifecycle status of Active.
- Where can I buy 573300D00010G?
- Send an RFQ to Makat and our AI agents source 573300D00010G across the whole supplier network, with verified offers inside 48 hours.