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Catalog

573300D00010G

Boyd Laconia, LLC · TO-263 · Active

HEATSINK D2PAK .4" HIGH SMD

Also listed as HS338TR, HS338DKR, 041644, HS338CT, Q4525657

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LifecycleActiveRoHSCompliantECCNEAR99HTSUS8473.30.5100
Manufacturer
Boyd Laconia, LLC
Product series
573300
Classification
Passive
Categories
Semiconductors · Electromechanical · Thermal Management · Heat Sinks
Type
Top Mount
Package / case
TO-263
Mounting style
Surface Mount
Packaging
Tape & Reel (TR)
Standard packaging qty
250
Manufacturer lead time
1568 days
Dimensions
0.500" (12.70mm) × 1.030" (26.16mm) × 0.400" (10.16mm)
Material
Copper
Depth
12.7mm
Shape
Rectangular
Width
26.16mm
Height
10.16mm
Show 8 more specifications
Length
26.16mm
Lead Free
Lead Free
REACH SVHC
No
Schedule B
8542900000
Height Off Base
10.16mm
Radiation Hardening
No
Natural Thermal Resistance
18°C/W
Thermal Resistance @ Forced Air Flow (100 LFM)
10°C/W

Common questions about 573300D00010G

What is 573300D00010G?
573300D00010G is HEATSINK D2PAK .4" HIGH SMD, manufactured by Boyd Laconia, LLC.
Who manufactures 573300D00010G?
573300D00010G is manufactured by Boyd Laconia, LLC.
What package does 573300D00010G come in?
573300D00010G comes in a TO-263 package (Surface Mount).
Is 573300D00010G RoHS compliant?
The RoHS status of 573300D00010G is: Compliant.
Is 573300D00010G still in production?
573300D00010G has a lifecycle status of Active.
Where can I buy 573300D00010G?
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